Shenzhen Cirket Electronics Co., Ltd. offers advanced PCB manufacturing services, including the production of blind and buried vias. Our blind vias are drilled from the outer layer of the board and stop at the next adjacent inner layer, allowing for interconnections between the outer layers and one or more inner layers. Buried vias are located between inner layers with no connection to the outer layers. These types of vias are essential for high-density and high-performance PCB designs, as they allow for more complex and compact layouts, Our blind and buried via technology enables the creation of smaller and lighter PCBs with improved signal performance. By utilizing state-of-the-art equipment and strict quality control measures, we ensure that our blind and buried vias meet the highest industry standards
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